发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device in which a nitride system semiconductor layer is formed on a silicon substrate to suppresses a leak current, and at the same time, to make high-speed operation possible. SOLUTION: The semiconductor device 1 is equipped with a silicon system substrate 2. On the silicon system substrate 2, a nitride system semiconductor layer 3 is formed as composed of nitride system chemical compound. On the nitride system semiconductor layer 3, an anode electrode 4 having a nitride semiconductor layer 3, and a Schottky junction and a cathode electrode 5 ohmicly contacted to the nitride system semiconductor layer 3, are formed. On the lower surface of the silicon system substrate 2, a lower electrode 6 is formed as electrically connected to the anode electrode 4. The lower electrode 6 has the silicon system substrate 2 and the Schottky junction, and is composed of metal or metal alloy having the large work function. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007208037(A) 申请公布日期 2007.08.16
申请号 JP20060025616 申请日期 2006.02.02
申请人 SANKEN ELECTRIC CO LTD 发明人 YANAGIHARA MASAKI
分类号 H01L29/872;H01L21/338;H01L29/47;H01L29/778;H01L29/78;H01L29/812 主分类号 H01L29/872
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