| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing method of laminated substrates allowing an electrode pad to be easily exposed outside in a dicing process even in the case when the electrode pad is located inside the lamination. SOLUTION: A method of dicing laminated substrates has: a step for forming a plurality of semiconductor wafers 3 of a semiconductor device; a step for laminating a semiconductor substrate 8 of the roughly same size as the semiconductor wafer 3 on the surface side of the semiconductor wafer with a spacer 7 in between; a step for performing half-cut dicing in such a manner that a dicing line 9 crosses a region between an electrode pad 4 and an element 6 in the same semiconductor device from the surface side of the semiconductor substrate; and a half-cut dicing step on the basis of the dicing line 5 separated into individual semiconductor devices from the surface side of the semiconductor wafer 3. Thereby, the electrode pad 4 can be easily exposed outside in the dicing step even in the case when the electrode pad 4 is inside the lamination. COPYRIGHT: (C)2007,JPO&INPIT |
