| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing multi-chip type semiconductor device which can improve reliability of a junction portion by reducing thermal interaction in a junction process between adjacent semiconductor chips. SOLUTION: In this method of manufacturing a semiconductor device, a solder layer 25 having a melting point lower than that of solder bumps 23 is formed on a land 24, and temporary fixing between the semiconductor chip 21 and the mounting substrate 22 is obtained by melting junction of the solder layer 25. Accordingly, since an individual semiconductor chip 21 on a mounting substrates 22 can be mounted at a temperature lower than that of a conventional method, a processing time of a mounting process can be shortened, and the thermal interaction in the junction process between the adjacent semiconductor chips 21 can be reduced, and thus, the reliability of the junction portion can be improved. Further, since main junction of the semiconductor chips 21 are simultaneously executed in a reflow process thereafter, the solder junction portion of each of the chips can be uniformly formed with higher reliability. COPYRIGHT: (C)2007,JPO&INPIT
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