| 摘要 |
PROBLEM TO BE SOLVED: To provide a stacked wafer using polyimide as a jointing material, its manufacturing method, and a substrate. SOLUTION: The invention relates to the stacked wafer in which the wafers of at least two layers are joined by a jointing material. The invention is characterized in that a single noncrystalline and thermally-adhesive aromatic polyimide (X) layer or a thermally-adhesive aromatic polyimide material in which a noncrystalline and thermally-adhesive aromatic polyimide (X) layer is provided on both surfaces of a substrate polyimide (Y) layer is used as a jointing material and a noncrystalline and thermally-adhesive aromatic polyimide (X) layer is an aromatic polyimide layer obtained from a component comprising 2, 3, 3', 4'-biphenyl tetracarboxylic acid, dianhydride of acid or ester of acid, and 1, 3-bis (4-amino phenoxy) benzene. COPYRIGHT: (C)2007,JPO&INPIT
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