SUBSTRATE HAVING METAL FILM, ITS PRODUCTION PROCESS, ELECTRONIC COMPONENT EMPLOYING THE SUBSTRATE AND ITS MANUFACTURING PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a substrate having a metal film in which adhesion between the substrate and the metal film can be enhanced by a simpler manufacturing process, and to provide its manufacturing process. SOLUTION: A monomolecular film 2 is formed on a substrate 1, and an intermediate film 3 is formed on the monomolecular film 2. A pyrrolyl group contained in the intermediate film 3 and a pyrrolyl group contained in the monomolecular film 2 are polymerized at least partially. The intermediate film 3 contains a metal, e.g. paladium, exhibiting catalytic capability in electroless plating. An electroless plating film 6 composing a metal film 5 is formed directly on the intermediate film 3 by electroless plating. With such an arrangement, adhesion between the substrate and the metal film can be enhanced as compared with prior art. COPYRIGHT: (C)2007,JPO&INPIT