| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting machine in which the adhesion of dust can be prevented when a semiconductor chip is mounted to a substrate. SOLUTION: The machine for mounting a semiconductor chip on a substrate comprises a machine body 1, a guide rail 2 performing the conveyance positioning of the substrate along the width direction of the machine body, a wafer table 4 disposed on the front side of the guide rail in the front and back direction of the machine body and supplied with a wafer ring 8 having a semiconductor wafer 11 divided into a large number of semiconductor chips 12, a tool 35 for mounting the semiconductor chip taken out of the wafer table on the substrate, and a nozzle body 40 for blowing clean air when the semiconductor chip is taken out of the wafer table in order to remove dust adhering to the semiconductor chip. COPYRIGHT: (C)2007,JPO&INPIT
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