发明名称 MOUNTING SUBSTRATE AND METHOD FOR SEALING IT
摘要 PROBLEM TO BE SOLVED: To provide a mounting substrate and a method for shielding it capable of magnetically shielding a through-hole without fitting a shield coating the whole connector and an exclusive shield for the through-hole. SOLUTION: In connectors 1 connected at terminals 2 for the substrate 3, surfaces excepting a surface directed toward the substrate in a main body formed of a molding resin are coated with a sealing material composed of a conductive material or a conductive board. At least parts of the through-holes 4 formed at the substrate 3 are arranged at places in lower sections of the connectors 1. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007207949(A) 申请公布日期 2007.08.16
申请号 JP20060023869 申请日期 2006.01.31
申请人 NEC ACCESS TECHNICA LTD 发明人 KUSANO EIICHIRO
分类号 H05K9/00;H01L23/12;H01R13/648;H05K1/18 主分类号 H05K9/00
代理机构 代理人
主权项
地址