发明名称 Halbleiterbauelementeanordnung mit ueber Kuehlfahnen gekuehlten Halbleiterbauelementen
摘要 1,144,582. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE A.G. 10 June, 1966 [10 June, 1965; 20 Aug., 19651, No. 26087/66. Heading H1K. A PN junction semi-conductor element in a housing consisting of metal cover-plates spaced apart by an insulator is held between a pair of electrically conductive cooling plates which have centrally disposed seatings and are supported at at least two peripheral regions by insulating distance-pieces. As shown in Fig. 1, a series of devices is arranged in a stack. In this case the plates are resilient and centrally dished to form a seating for the device which may be inserted by pushing the plates apart. The distance pieces 13 &c. which each have three protrusions on one face and mating blind bores on the other interlock through corresponding holes formed in the plates and are threaded on rods SP with the cooling plates which have tabs to facilitate electrical connection. In an alternative arrangement two cooling plates connected at their centres by a cooling block and spaced by distance-pieces at the periphery are disposed on each side of each device. The devices may be silicon rectifiers in sealed housings consisting of a metallized ceramic ring with silver end-plates, Fig. 5 (not shown). Each rectifier consists of a silicon wafer alloyed to silver plates, on one face with aluminium and on the other with gold-antimony, the silver plates in turn being attached to molybdenum blocks. Electrical and thermal contact to the housing walls may be improved by disposing ductile inserts between them and the cooling plates.
申请公布号 DE1514477(A1) 申请公布日期 1969.04.24
申请号 DE19651514477 申请日期 1965.06.10
申请人 SIEMENS AG 发明人 VOGT,HERBERT
分类号 H01L23/40;H01L25/03;H01L25/11 主分类号 H01L23/40
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