ELECTROSTATIC CHUCK

摘要

[PROBLEMS] To provide an electrostatic chuck that, even after exposure to plasma, can maintain a smooth surface and consequently can suppress contamination of a material to be adsorbed, such as a silicon wafer, with particles, is excellent in adsorption and desorption properties of an adsorbent material, and can easily be prepared by low-temperature firing. [MEANS FOR SOLVING PROBLEMS] An electrostatic chuck comprising a dielectric material for an electrostatic chuck. The dielectric material comprises not less than 99.4% by weight of alumina, more than 0.2% by weight and not more than 0.6% by weight of titanium oxide, has a volume resistivity at room temperature of 10<SUP>8</SUP> to 10<SUP>11</SUP> Ocm, and has a structure in which titanium oxide is segregated at the boundary of alumina particles.