发明名称 HEAT CONDUCTION SUBSTRATE AND SHEET, AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat conduction sheet in which heat in a heater can effectively be conducted to a container with a simple structure and simple manufacture, and which can be used in a clean room without deterioration of heat conduction efficiency even if the container with a large amount of chemical is frequently exchanged. <P>SOLUTION: The heat conduction sheet 3 is laid in a gap between a heater 21 and the container heated by the heater 21. A metal thin film material is repetitively and regularly bent and deformed in a prescribed direction. The metal thin film material is pushed and hardened so that it irregularly bends finely so as to make it into prescribed thickness. Thus, a heat conduction substrate 30 includes a heat transmission route where the metal thin film materials are connected or are brought into contact with each other and a minute gap scattering between the heat conduction routes. The heat conduction substrates 30 are arranged in a shape corresponding to a contact face shape of the container. The contact side of the heat conduction substrate 30 with the container is covered with a sheet material 40 having heat conductivity. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007207846(A) 申请公布日期 2007.08.16
申请号 JP20060022449 申请日期 2006.01.31
申请人 TOAGOSEI CO LTD 发明人 SUMITA MASANAO;OZAKI SANEAKI;NAKAMURA HIROSHI
分类号 H01L23/36;B32B3/10 主分类号 H01L23/36
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