| 摘要 |
PROBLEM TO BE SOLVED: To provide a die attach paste for semiconductor or a material for bonding heat-releasing component, low in elastic modulus and excellent in stress relaxation properties in particular, and to provide a semiconductor device excellent in reliability such as reflow resistance in particular. SOLUTION: A resin composition comprises (A) a compound having at least one polymerizable unsaturated bond, being a polyester polyol derivative obtained by reaction between a diol and a dimer acid or a dimer acid with its double bond hydrogenated, (B) a polymerization initiator and (C) a filler. The semiconductor device is characterized in being made by using the resin composition as the die attach paste or the material for bonding heat-releasing component. COPYRIGHT: (C)2007,JPO&INPIT |
