| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board having an excellent electric connectability by sufficiently increasing the adhesive strength of conductors between layers to prevent poor connection, and to provide its manufacturing method. SOLUTION: The manufacturing method of the multilayered wiring board 16A comprises processes of: forming first insulation layers 3 each of which contains conductor patterns 2 and via conductors 7, and whose top face is nearly flush with the top face of the conductor patterns 2; forming second insulation layers 15 each of which contains conductor patterns 17 and the via conductors 7, and has at least part of the conductor patterns 17 projecting from the top face; forming a laminate 16 by stacking a plurality of the first insulation layers 3 and/or the second insulation layers 15, so that the second insulation layer 15 may be located in at least either the most upper or most lower layer, and the conductor patterns 17 of the second insulation layer 15 may be exposed outside; and applying pressure to the laminate 16 in the stacking direction. COPYRIGHT: (C)2007,JPO&INPIT |
