| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for uniformly covering a particle surface with a thin film by using a sputtering or vapor deposition technique, and to provide an apparatus to be used therefor. SOLUTION: The method for covering the particle surface with the thin film of a covering material by using the sputtering or vapor-depositing technique includes the steps of: accommodating the particles in a particle container with a shape of a bottomed cylinder; tilting a rotation axis of the cylinder of the particle container at a predetermined angle against a horizontal direction; and rotating the particle container around the axis of the cylinder to agitate the particles. COPYRIGHT: (C)2007,JPO&INPIT
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