| 摘要 |
In a semiconductor device 10 , an electrode terminal 18 of a semiconductor element 14 embedded in an insulating layer 12 formed by a resin forming a substrate and a land portion 20 forming an external connecting terminal are electrically connected to each other through a wiring pattern 22 formed on the insulating layer 12 . The wiring pattern 22 including the land portion 20 is formed by a plating metal 26 . A metallic wire 24 having one of ends connected to the electrode terminal 18 is provided in the plating metal 26 along the wiring pattern 22.
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