| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition used for manufacturing a printed wiring board, which achieves reduction of size, increase in density of the wiring board, simplification of steps, improvement of the connection reliability, and the yield of the board. <P>SOLUTION: The photosensitive resin composition is used for a plating resist, where, when the total number of moles ΣM (per 1 kg of solid content of the photosensitive resin composition) of reactive groups in a photo-polymerizing compound i, each molecule thereof having a polymerizable ethylene non-saturated group therein, is given by the following formula (I): (where, Mi is the number of moles of the photo-polymerizing compound i, Ni is the number of reactive groups of the photo-polymerizing compound i, and k is the total number of the photo-polymerizing compound in the composition), ΣM is 0.3 to 1.5 mol. <P>COPYRIGHT: (C)2007,JPO&INPIT |
