发明名称 Transmission line with a transforming impedance and solder lands
摘要 A transmission line for high-frequency differential signals and having a transforming impedance is formed into a substrate. The transmission line is comprised of a slot, the opposing surfaces of which carry a conductive surface capable of carrying electrical signals. The conductive surface on the opposing surfaces is gradually receded along a length of the slot. An equivalent amount of metallization is applied on the substrate's surface and electrically continuous with conductive surfaces on the slot's opposing sidewalls. The metallization on the substrate's surface provide solder lands. Dielectric in the slot prevents solder wicking.
申请公布号 US2007188261(A1) 申请公布日期 2007.08.16
申请号 US20060643076 申请日期 2006.12.21
申请人 BRUNKER DAVID L;ZADEREJ VICTOR 发明人 BRUNKER DAVID L.;ZADEREJ VICTOR
分类号 H01P5/02;H01P3/02;H01P3/08;H05K1/02;H05K3/10 主分类号 H01P5/02
代理机构 代理人
主权项
地址