| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldering apparatus capable of preventing the occurrence of voids; a soldering method; and a method for manufacturing a semiconductor device. <P>SOLUTION: A reducing gas is introduced into a reflow chamber 20, and pressure in the reflow chamber 20 is set to the one higher than a normal pressure (e.g., 0.13 MPa). In the reflow chamber 20, an object to be soldered is heated under the condition that it is pressurized with the reducing gas for soldering. <P>COPYRIGHT: (C)2007,JPO&INPIT |
