MEASUREMENT METHOD, EXPOSURE METHOD, DEVICE MANUFACTURING METHOD, MEASURING MARK, AND MASK

摘要

PROBLEM TO BE SOLVED: To obtain a measurement value approximate to a misalignment quantity of an actual device pattern image when the quantity of misalignment of the projected image of a specified mark is measured.

SOLUTION: A second mark image is overlaid on a first mark and they are exposed, and the misalignment is measured between the first mark and the second mark image. In this case, the second mark is provided with a plurality of line marks 36D and 36E of which transmission is lower than those of the periphery, and a width of the line mark 36D inside a specified edge 38A is set larger than that of the line mark 36E outside the edge 38A.

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