DEVICE AND METHOD FOR PRESSURE-BONDING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a pressure-bonding device which can prevent the breakage of a board and also can pressure-bond electronic components satisfactorily. SOLUTION: An electronic component pressure-bonding device arranges and mounts a plurality of electronic components 2 in a straight line on a board 1 using a buffer member 36. The device includes a pressing tool 21 applying a pressure to the electronic components; a pressure receiving tool 29 provided facing the pressing tool; a board supporting tool 31 for supporting the board between the pressing tool and the pressure receiving tool; a buffer member supporting tool 34 for supporting the buffer member between the board and the pressing tool; a position adjusting device 35 connected to at least one of the pressing tool and the buffer member supporting tool, and relatively moving the pressing tool and the buffer member supporting tool in the straight line direction; and a controller for controlling the pressing tool thereby pressure-bonding the board and the electronic components. COPYRIGHT: (C)2007,JPO&INPIT