发明名称 Material for forming exposure light-blocking film, multilayer interconnection structure and manufacturing method thereof, and semiconductor device
摘要 To provide a material for forming an exposure light-blocking film which includes at least one of a silicon compound expressed by the following structural formula (1) and a silicon compound expressed by the following structural formula (2), wherein at least one of R<SUP>1 </SUP>and R<SUP>2 </SUP>is replaced by a substitutent capable of absorbing exposure light. (where R<SUP>1 </SUP>and R<SUP>2 </SUP>may be the same or different, and each represents any one of a hydrogen atom, alkyl group, alkenyl group, cycloalkyl group and aryl group which are optionally substituted, and n is an integer of 2 or greater) (where R<SUP>1</SUP>, R<SUP>2 </SUP>and R<SUP>3 </SUP>may be the same or different, at least one of R<SUP>1</SUP>, R<SUP>2 </SUP>and R<SUP>3 </SUP>represents a hydrogen atom and the others represent any one of an alkyl group, alkenyl group, cycloalkyl group and aryl group which are optionally substituted, and n is an integer of 2 or greater)
申请公布号 US2007190461(A1) 申请公布日期 2007.08.16
申请号 US20060477377 申请日期 2006.06.30
申请人 FUJITSU LIMITED 发明人 OZAKI SHIROU;NAKATA YOSHIHIRO
分类号 G03F7/26;B32B9/04;C08G77/60;G03C5/00;H01L21/312;H01L21/314;H01L21/768;H01L23/522 主分类号 G03F7/26
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