发明名称 METHOD OF FORMING DEPOSITION FILM AND METHOD OF FORMING PHOTOVOLTAIC ELEMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of forming a deposition film by which an improvement of a conversion efficiency can be compatible with a suppression of a photo degradation at a high level by optimizing a forming qualification of the deposited film, and an optimal deposited film forming condition searched by an experimental device can be easily diverted to production apparatus or the like. <P>SOLUTION: In the method of forming the deposited film including microcrystalline silicon by a plasma CVD method, at least one of conditions is changed between a condition for forming the deposited film in a microcrystalline region and a qualification for forming the deposited film in an amorphous region as chosen from a high-frequency electric power density, a bias voltage to an interelectrode distance, a bias current to an electrode area, a high-frequency electric power to a material gas flow rate, a ratio of a diluent gas flow rate to the material gas flow rate, a substrate temperature, pressure, and the interelectrode distance. In this case, a formation of the deposited film is performed under a condition of a decided range very closed to a boundary condition in which a crystal system of the deposited film is substantially changed by an amorphous and a microcrystal. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007208093(A) 申请公布日期 2007.08.16
申请号 JP20060026625 申请日期 2006.02.03
申请人 CANON INC 发明人 TAKAI YASUYOSHI;SANO MASAFUMI;SAITO KEISHI
分类号 H01L31/04;H01L21/205 主分类号 H01L31/04
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