| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for forming a bonding layer having a low modulus of elasticity and high thermal-shock resistance, and to provide a ceramic bonding layer formed from the composition and a ceramic bonded article having the ceramic bonding layer. SOLUTION: The composition for ceramic bonding comprises 3-55% by volume of ceramic particles, 1-25% by volume of an inorganic binder, and a liquid medium, wherein the composition further contains hollow particles. In addition, the composition for ceramic bonding comprises the ceramic bonding layer formed by applying the composition to a bonding surface of a ceramic molded body and then heating the composition applied. COPYRIGHT: (C)2007,JPO&INPIT
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