发明名称 Method of manufacturing semiconductor device, and semiconductor device
摘要 A first hydrogen barrier film and an intermediate layer are formed on an interlayer dielectric film. A ferroelectric capacitor is formed on the intermediate layer, and a second hydrogen barrier film is formed over the entire surface including on the upper surface and side surfaces of the ferroelectric capacitor and on the intermediate layer. Then, the second hydrogen barrier film and the intermediate layer are removed while leaving at least portions on the upper surface and side surfaces of the ferroelectric capacitor. Then, a third hydrogen barrier film is formed on the second hydrogen barrier film, on side surfaces of the second hydrogen barrier film and the intermediate layer, and on the first hydrogen barrier film.
申请公布号 US2007187735(A1) 申请公布日期 2007.08.16
申请号 US20070787450 申请日期 2007.04.16
申请人 TAKANO KATSUO 发明人 TAKANO KATSUO
分类号 H01L29/94;H01L21/02;H01L21/8246;H01L27/105;H01L27/115;H01L29/76 主分类号 H01L29/94
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