| 摘要 |
A wafer coating apparatus and its coating method are provided to enhance the reliability of a coating process by accurately controlling the amount of a chemical, which is coated on a wafer. A wafer coating apparatus includes a rotation chuck(400), a dispenser unit, a weight sensor(500), a weight compensator(600), and a dispenser controller(700). A wafer is mounted on the rotation chuck. The dispenser unit supplies a chemical on the wafer. The weight sensor detects a weight of the supplied chemical. The weight compensator compares the detected weight of the chemical with a reference coating weight of the chemical. The dispenser controller receives a signal from the weight comparator and controls the dispenser unit to adjust an application amount of the chemical.
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