| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a capacitor structure, a wiring board using it and a manufacturing method for it. <P>SOLUTION: The structure (11) is disposed in a resin insulating layer, and has the structure alternately laminating dielectric layers (112) and conductor layers (111). The dielectric layers (112) and the conductor layers (111) are baked simultaneously, oxide films formed on the surfaces of the conductor layers (111) are removed in the case of the simultaneous baking, and the external surfaces of the conductor layers (111) are coupling-treated. The wiring board has the conductor layers laminated on a core board and the resin insulating layer, and the capacitor structure disposed in the resin insulating layer. The manufacturing method for the wiring board is used as the manufacturing method. The manufacturing method has a process removing the oxide films of the capacitor structure having the oxide films on the external surfaces of the conductor layers (111), the process coupling-treating the external surfaces of the conductor layers (111) removing the oxide films, and the process arranging the capacitor structure (11) in the resin insulating layer. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
