| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized and inexpensive ceramic substrate. SOLUTION: In a ceramic substrate of the present invention, there is provided a state of connecting small hole diameters of holes 3 in lamination. Therefore, when a wiring pattern 5 is formed between laminations in which small hole diameters are connected, the wiring pattern 5 may be formed, in a state of avoiding the small hole diameters. Accordingly, the wiring pattern 5 can be made high in density in the lamination, and a ceramic substrate 1 can be made smaller, and along with a tendency of smaller ceramic substrate, a material cost is reduced, thus making it possible to obtain an inexpensive ceramic substrate. COPYRIGHT: (C)2007,JPO&INPIT |
