| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device by sticking a tape on a semiconductor wafer without producing an air bubble between the tape and the semiconductor wafer. SOLUTION: When the surface protective tape 3 of the semiconductor wafer 2 is stuck, a roller 1 such that the shape or material of a roller surface has unevenness for applying a force to a step between chips formed on the semiconductor wafer 2 and is rotatable is used to apply the pressure of the roller 1 following up unevenness of the chip, so the surface protective tape 3 can be stuck without producing any air bubble between the surface protective tape 3 and semiconductor wafer 2, even when they are not heated for the sticking to improve the reliability of the semiconductor device. COPYRIGHT: (C)2007,JPO&INPIT
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