| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit module capable of preventing the displacement of a mounted component by the exhibition of a self alignment function at the time of solder condensation, even if a resist layer is not prepared. SOLUTION: The electronic circuit module is constituted such that a wiring pattern 2 consisting of a metal plating layer is formed in the surface of a base mount 1 in a prismatic shape, and electronic components 3 are mounted on this wiring pattern 2. The base mount 1 is a mold component formed by two color molding which unifies a columnar body 4 composed of non-plating grade resin and a winding-around body 5 composed of plating grade resin. The wiring pattern 2 is formed by carrying out non-electrolyzed plating to the surface of the winding-around body 5. An electrode pad 2a to which cream solder 6 is applied is formed in a prescribed position of this wiring pattern 2. Solder junction of a terminal 3a of the electronic components 3 is carried out on the electrode pad 2a. Further, a pad adjoining section 2b which follows the electrode pad 2a among the wiring patterns 2 is formed in the surface of the recess 1a of the base mount 1. COPYRIGHT: (C)2007,JPO&INPIT
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