| 摘要 |
PROBLEM TO BE SOLVED: To rapidly and efficiently design a semiconductor device having a stable power supply structure to a semiconductor chip having a super multi-pin, high-density, multilayer wiring board structure and a multi-power source and multifunctional macro block. SOLUTION: A semiconductor chip is superposed on a semiconductor substrate while matching the central coordinate of XY plane of the semiconductor chip with the central coordinate of XY plane of the semiconductor substrate (S6), vias connected to wiring layers of power supply layers/ground layers/wiring layers from a start point of wiring of the semiconductor chip are disposed in Z direction, and the wiring layer number of the power supply layers/ground layers/wiring layers of the semiconductor substrate is set (S11). A via matrix which forms XYZ coordinates of a three-dimensional coordinate system in which grid lines are drawn in XY direction and XZ direction based on the start point and end point of wiring in a two-dimensional orthogonal coordinate system consisting of ZY plane and ZY plane and vias are disposed at intersections of the grid lines is determined, and the vias are disposed in XZ direction based on the via matrix and connected to designated power supply layers/ground layers/wiring layers (S13). COPYRIGHT: (C)2007,JPO&INPIT
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