发明名称 METHOD OF INSPECTING PLATING, AND METHOD OF INSPECTING LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To provide an imaging method suitable for inspecting precisely a defect in a plated lead frame without depending on manual work, and a method of inspecting plating for inspecting automatically the plating defect on a real time with high reliability. SOLUTION: This method of inspecting the plating defect carries out the inspection by imaging a plated surface irradiated by an irradiation means 10, using the irradiation means 10 for irradiating the plating with light beam having 600 nm or more of wavelength, and an imaging means 20 having sensitivity within a wavelength area thereof. The method is provided with: the irradiation means 10 for irradiating the plating with the light beam having the 600 nm or more of wavelength; the imaging means 20 for imaging the plated surface irradiated by the irradiation means 10, and an image processing/defect determining means 30 for determining the presence of the defect on the plating, based on an image data obtained by the imaging means, to perform the inspection. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007205974(A) 申请公布日期 2007.08.16
申请号 JP20060026850 申请日期 2006.02.03
申请人 TOPPAN PRINTING CO LTD 发明人 OKAYA SHINJI;MIHASHI MITSUSACHI
分类号 G01N21/84;G01N21/956 主分类号 G01N21/84
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