发明名称 PLASMA DOPING METHOD
摘要 A plasma doping method that can control a dose precisely is realized. In-plane uniformity of the dose is improved. It has been found that, if a bias is applied by irradiating B<SUB>2</SUB>H<SUB>6</SUB>/He plasma onto a silicon substrate, there is a time at which a dose of boron is made substantially uniform, and the saturation time is comparatively long and ease to stably use, compared with a time at which repeatability of an apparatus control can be secured. The invention has been finalized focusing on the result. That is, if plasma irradiation starts, a dose is initially increased, but a time at which the dose is made substantially uniform without depending on a time variation is continued. In addition, if the time is further increased, the dose is decreased. The dose can be accurately controlled through a process window of the time at which the dose is made substantially uniform without depending on the time variation.
申请公布号 US2007190759(A1) 申请公布日期 2007.08.16
申请号 US20070741861 申请日期 2007.04.30
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SASAKI YUICHIRO;OKASHITA KATSUMI;ITO HIROYUKI;MIZUNO BUNJI;OKUMURA TOMOHIRO
分类号 H01L21/26;H01L21/42 主分类号 H01L21/26
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