POLISHING AGENT FOR BARRIER LAYER

摘要

PROBLEM TO BE SOLVED: To provide a polishing agent for a barrier layer which uses solid abrasive grains for use in a barrier CMP which polishes a barrier metal material and which can suppress an erosion and a scratch.

SOLUTION: The polishing agent for the barrier layer for polishing the barrier layer of a semiconductor integrated circuit contains colloidal silica which has part of a surface covered with aluminum and an oxidizing agent wherein pH is in a range of 2 to 7.

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