Power semiconductor modul with contact arrangement

摘要

The module (1) has power semiconductor components (60) arranged on a substrate (5). Load connecting units (4) are designed as metallic molded bodies, where each connecting unit has a contact device (40) with a contact surface (42) for external electric connection of the connecting units with a connecting device (82) of an external conductor of a power supply line (8). A metallic molded padding (70) is arranged between the connecting device and the contact devices, when the contact devices are fastened to the conductor, where the padding is twisted at 10 degree around its vertical axis.