| 摘要 |
<p>The arrangement has a cooling component (50). The power semiconductor module (1) has a substrate (5) arranged on two power semiconductor elements (60,64), a housing (3), load connection elements (40,42,44) and control port elements. The power semiconductor module has a dimensionally stable pressure plate (72) and a flexible pressure accumulator (74) with a pressure device (70). The substrate has an insulating body (52). The cooling component, the housing and the pressure plate form a unit. Another unit is formed from substrate and load connection elements. An independent claim is also included for a method for the production of the arrangement.</p> |
