| 摘要 |
<p>PROBLEM TO BE SOLVED: To make not to influence a flexible sheet caused by heat generation by so providing the flexible sheet as to keep a constant space from a hybrid integrated circuit board. SOLUTION: A general purpose circuit is mounted on a hybrid integrated circuit board 10 and a custom circuit which enhances a function of the general purpose circuit is mounted on a flexible sheet 20. A projecting part 16 is provided on the hybrid integrated circuit board 10 and fixing holes 23 are provided on the flexible sheet 20, therefore fixing can be made by points without applying adhesive agent on the whole surface of the flexible sheet and the flexible sheet does not break because a difference of thermal expansions between the hybrid integrated circuit board and the flexible sheet does not directly influence.</p> |
