发明名称 SOI SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>A SOI substrate of high quality which allows LSI to be formed thereon in an improved yield and realizes excellent electric properties and a method for the production thereof are provided. The SOI substrate is obtained by forming an embedded oxide layer on a silicon single crystal substrate and forming a SOI layer for the formation of a device on the embedded oxide layer and is characterized by the SOI layer containing pit-like defects at a density of not more than 5 cm<-2> or the embedded oxide layer containing pinhole defects at a density of less than one piece/cm<2>. <IMAGE></p>
申请公布号 EP1052687(A4) 申请公布日期 2007.08.15
申请号 EP19990901218 申请日期 1999.02.02
申请人 NIPPON STEEL CORPORATION 发明人 HAMAGUCHI, ISAO;IKARI, ATSUSHI;MATSUMURA, ATSUKI;KAWAMURA, KEISUKE;YANO, TAKAYUKI;NAGATAKE, YOICHI
分类号 H01L21/265;H01L21/322;H01L21/762;(IPC1-7):H01L21/265;H01L27/12 主分类号 H01L21/265
代理机构 代理人
主权项
地址