| 摘要 |
There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate 12 is bonded to one side of a ceramic substrate 10 , and a heat sink plate (metal base plate) 14 is bonded to the other side thereof. On the heat sink plate 14 , a work-hardened layer 16 is formed by shot peening. On the metal circuit plate 12 of the metal/ceramic bonding substrate, semiconductor chips (Si chips) 18 are soldered (solder layer 20 ). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer 16 ) of the power module, a radiating fin 26 is mounted via a thermal grease 24 by means of screws 22 or the like.
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