发明名称 Resistance-reduced semiconductor device and methods for fabricating the same
摘要 Semiconductor devices and methods for fabricating the same. The semiconductor device includes a resistance-reduced transistor with metallized bilayer overlying source/drain regions and gate electrode thereof. A first dielectric layer with a conductive contact overlies the resistance-reduced transistor. A second dielectric layer having a first conductive feature overlies the first dielectric layer. A third dielectric layer with a second conductive feature overlies the second dielectric layer, forming a conductive pathway down to the top surface of the metallized bilayer over one of the source/drain regions or the gate electrode layer.
申请公布号 US7256498(B2) 申请公布日期 2007.08.14
申请号 US20050190913 申请日期 2005.07.28
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 HUANG YI-CHUN;SHIEH JYU-HORNG;HSU JU-WANG
分类号 H01L27/04;H01L21/28;H01L21/285;H01L21/336;H01L21/60;H01L29/06;H01L29/76;H01L31/062 主分类号 H01L27/04
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