发明名称 Radial-biased polishing pad
摘要 The polishing pad is useful for polishing magnetic, optical and semiconductor substrates. The pad includes a polishing layer having a rotational center and an annular polishing track concentric with the rotational center and has a width. The width of the annular polishing track is free of non-radial grooves. And the pad has a plurality of radial micro-channels in the polishing layer within the width of the annular polishing track with a majority of the radial micro-channels having primarily a radial orientation and an average width less than 50 mum.
申请公布号 US7255633(B2) 申请公布日期 2007.08.14
申请号 US20060392373 申请日期 2006.03.29
申请人 ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 发明人 MULDOWNEY GREGORY P.
分类号 B24B7/22;B24D99/00;B24B37/26;B24D13/14 主分类号 B24B7/22
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