发明名称 |
Radial-biased polishing pad |
摘要 |
The polishing pad is useful for polishing magnetic, optical and semiconductor substrates. The pad includes a polishing layer having a rotational center and an annular polishing track concentric with the rotational center and has a width. The width of the annular polishing track is free of non-radial grooves. And the pad has a plurality of radial micro-channels in the polishing layer within the width of the annular polishing track with a majority of the radial micro-channels having primarily a radial orientation and an average width less than 50 mum.
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申请公布号 |
US7255633(B2) |
申请公布日期 |
2007.08.14 |
申请号 |
US20060392373 |
申请日期 |
2006.03.29 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
MULDOWNEY GREGORY P. |
分类号 |
B24B7/22;B24D99/00;B24B37/26;B24D13/14 |
主分类号 |
B24B7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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