发明名称 Chemically amplified positive photosensitive resin composition
摘要 A photosensitive resin composition suitable for forming a thick film and an ultra-thick film used for forming a thick resist pattern used in the process of forming a magnetic pole on a magnetic head and a bump, which comprises (A) an alkali soluble novolak resin, (B) an alkali soluble acrylic resin, (C) an acetal compound, and (D) an acid generator. A polycondensate comprising a structural unit represented by the following general formula (I) (wherein R represents a saturated alkyl group having 1 to 20 carbon atoms, n is an integer of 1 to 10) as an acetal compound
申请公布号 US7255972(B2) 申请公布日期 2007.08.14
申请号 US20050532364 申请日期 2005.04.20
申请人 AZ ELECTRONIC MATERIALS USA CORP. 发明人 NISHIWAKI YOSHINORI;MAKII TOSHIMICHI
分类号 G03F7/039;G03C1/492;G03F7/004;G03F7/027;G03F7/40 主分类号 G03F7/039
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