发明名称 |
Substrate centering apparatus and method |
摘要 |
A semiconductor substrate centering mechanism includes a plurality of substrate support pins, each pin having a top surface. The top surfaces of the pins define a plane in which the substrate is supported. Each pin has a tab mounted eccentrically at the top surface of the pin. The tabs extend upwardly relative to the top surfaces of the pins. The centering mechanism further includes a pin rotation mechanism adapted to rotate each pin. The pin rotation mechanism rotates the pins between a first position in which the tabs define an envelope that is larger than a circumference of the substrate and a second position in which the tabs define a centered position for the substrate. A telescoping arrangement of nesting shield segments may also be provided for each pin to prevent processing fluid from reaching a shaft of the pin. In one aspect the centering mechanism is coupled to a substrate support of a substrate processing location, and thus allows a substrate to be centered as it is lowered to the processing location.
|
申请公布号 |
US7256132(B2) |
申请公布日期 |
2007.08.14 |
申请号 |
US20030631650 |
申请日期 |
2003.07.31 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
LERNER ALEXANDER;TEPMAN AVI;OLGATO DONALD |
分类号 |
H01L21/302;H01L21/461;H01L21/68 |
主分类号 |
H01L21/302 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|