发明名称 |
Method for treating a wafer edge |
摘要 |
A method for treating an edge portion of a wafer with a plasma or select chemical formulation in order to enhance adhesion characteristics and inhibit delamination of a layer of material from the wafer surface only on the edge portion that is being treated. Alternatively, the method may be utilized to effectuate a cleaning of an edge portion of a wafer.
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申请公布号 |
US7256148(B2) |
申请公布日期 |
2007.08.14 |
申请号 |
US20050908441 |
申请日期 |
2005.05.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KASTENMEIER BERND E.;KNORR ANDREAS |
分类号 |
H01L21/26 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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