发明名称 |
Methods and fixture for coupling a lid to a support substrate |
摘要 |
A method for coupling a lid to a support substrate having a semiconductor chip coupled thereto and a clamp fixture. Each semiconductor component has a semiconductor chip mounted to a semiconductor component and a lid coupled to the support substrate via a lid attach material. The lid attach material is cured either using a two-step process that includes a partial cure step followed by a clampless cure step or by curing the die attach material in a clamp fixture without including a pre-cure step. The semiconductor component manufacture decides on the curing approach based on cost and the number of semiconductor components being manufactured. If the semiconductor manufacturer opts for curing with a clamp fixture, the clamp fixture includes a base plate insert on which the semiconductor components are placed and a compression mechanism that includes a compression plate having a compressive material disposed thereon.
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申请公布号 |
US7256065(B1) |
申请公布日期 |
2007.08.14 |
申请号 |
US20040859673 |
申请日期 |
2004.06.03 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
TOO SEAH SUN;ALCID EDWARD;JUWANDA AHMAD;CHA KENG SANG;KAM LEANG HUA;TAN TEK SENG |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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