发明名称 SEMICONDUCTOR CHIP PACKAGE DEPOSIT APPARATUS AND METHOD USING FLUORINATED KETONE
摘要 <p>An apparatus for storing a semiconductor chip package using fluorinated ketone is provided to vaporize residual fluorinated ketone liquid by making a semiconductor chip package soak into fluorinated ketone liquid while the semiconductor chip package is stagnated between fabricating processes and by performing a bake process. A fluorinated ketone room(20) includes a loading part(10) and at least one solution bath. A semiconductor chip package is loaded into the loading part. Fluorinated ketone liquid into which the semiconductor chip package inserted into the loading part is soaked is put into the at least one solution bath. An oven(30) vaporizes the fluorinated ketone liquid remaining on the semiconductor chip package taken out from the fluorinated ketone room. A transfer unit(40) transfers the semiconductor chip package from the loading part to the fluorinated ketone room and from the fluorinated ketone room to the oven. The loading part, the fluorinated ketone room and the oven are interconnected and intercepted by a mask window. An oven for baking the semiconductor chip package can be installed in the loading part.</p>
申请公布号 KR20070080895(A) 申请公布日期 2007.08.14
申请号 KR20060012377 申请日期 2006.02.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 NA, MIN OK
分类号 H01L23/28;H01L21/677 主分类号 H01L23/28
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