发明名称 Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure
摘要 A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The laminate is formed by placing a mask onto a packaging film and vapor-depositing aluminum onto the packaging film and the mask. After removal of the mask, only a desired antenna structure remains on a section of the packaging film. Then a microchip, is adhesively bonded to the packaging film and conductively connected to an end of the antenna structure, so that data can be written in or read out without contact in a wireless transponder system.
申请公布号 US7254883(B2) 申请公布日期 2007.08.14
申请号 US20050124593 申请日期 2005.05.06
申请人 INFINEON TECHNOLOGIES AG 发明人 SCHMID GUENTER;KLAUK HAGEN;HALIK MARCUS
分类号 H02P11/00;B32B15/20;B65D5/42;G06K19/077;H01Q1/22;H01Q7/00 主分类号 H02P11/00
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