| 摘要 |
A method of manufacturing a multi-layered substrate is provided to facilitate a manufacturing process of the multi-layered substrate by using an ink-jet process for forming a component covering layer. First and second electronic components(40,41) are arranged on a surface of a base layer(5) using a mounter. The first electronic component is arranged to orient two terminals(40A,40B) of the first electronic component upward. The second electronic component is arranged to orient two terminals(41A,41B) of the first electronic component upward. The base layer includes a flexible board made of a polyimide and has a tape-like shape. After the electronic components are arranged, an insulation sub-pattern(10) is formed on a region of the base layer, where the electronic components are not arranged, by using an ink-jet sub-process. |
