发明名称 WAFER COOLING PLATE HAVING WAFER SUPPORTING PINS AND WAFER COOLING APPARATUS EMPLOYING THE SAME
摘要 A wafer cooling plate having a wafer support pin is provided to control separation of second wafer support pins from a wafer support plate by disposing the second wafer support pins in a manner that the second wafer support pins are coupled to first wafer support pins on the wafer support plate. A second wafer support plate(34) is disposed on a first wafer support plate(32) having a cooling pipe(36). First wafer support pins(44a). Second wafer support pins(44b) have insert grooves(46) into which the first wafer support pins are inserted. First screw threads are disposed on the outer circumference of the first support pins, and second screw threads are disposed on the sidewall of the insert grooves.
申请公布号 KR20070080791(A) 申请公布日期 2007.08.13
申请号 KR20060012281 申请日期 2006.02.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, YOUNG JIN
分类号 H01L21/22 主分类号 H01L21/22
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