SEMICONDUCTOR FRAME HAVING RESIN MOLDING PORTION PROTRUDED

摘要

A semiconductor substrate having a protruded resin molding portion is provided to distribute the stress concentrated on the circumference of the edge of a resin molding portion by a difference of a thermal expansion coefficient between a resin molding portion and a printed circuit board by forming a protrusion portion on the circumference of the edge of the upper surface of the resin molding portion encapsulating the upper part of the printed circuit board. A semiconductor frame(10) includes a printed circuit board(20), at least one semiconductor chip(30) mounted on the printed circuit board, and a resin molding portion including the semiconductor chip and the upper part of the printed circuit board. A protrusion portion(41) is formed on the circumference of the edge of the upper surface(21) of the resin molding portion. A part or all of the semiconductor chip mounted on the printed circuit board can be molded by the resin molding portion.