| 摘要 |
A defect detecting apparatus and a method of a semiconductor substrate are provided to detect quickly defects of the substrate in spite of the use of relatively small light quantity of infrared ray by using a line sensor camera. A defect detecting apparatus includes an inspection stage(210) with an inspection region made of a transparent material, an optical unit(220) for irradiating infrared rays onto a semiconductor substrate of the inspection stage at a lower end portion of the inspection stage, an image pickup unit, a transfer unit, a control unit, and a defect detecting unit. The image pickup unit(230) is composed of a plurality of line sensors with a band type photographing region. The image pickup unit is used for detecting the infrared rays transmitted through the substrate and outputting an image signal. The transfer unit(240) is used for transferring the image pickup unit and the inspection stage to a cross-section direction of the photographing region of the line sensor and outputting a pulse signal with a predetermined cycle corresponding to a relative linear movement distance between the image pickup unit and the inspection stage. The control unit(250) is used for controlling a photographing process on the substrate on the basis of the number of pulse signals. The defect detecting unit(260) is used for generating an inspection image corresponding to the substrate by coupling the image signal of the image pickup unit and detecting the position of defect existing on the substrate.
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