PHOTORESIST AND METHOD FOR FORMING PHOTORESIST PATTERN USING THE SAME

摘要

Provided is a photoresist having improved flowability and excellent adhesion, and improving thickness uniformity of coating film upon coating of photoresist. A photoresist comprises 10-20wt% of a polymer resin, 2-10wt% of a photosensitive compound, and 60-90wt% of a solvent. The polymer resin contains an alkylol cresol novolak resin represented by the following formula(1), wherein each R1, R2, R3, and R4 is a hydrogen atom or alkyl group, and at least one of the R1, R2, R3, and R4 is a hydroxy alkyl group. The polymer resin has a weight average molecular weight of 3000-10000.